Method of manufacturing a semiconductor power module and the power converting apparatus and a semiconductor power module mounted canal forming body which is mounted

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor power module that reduces loss.;SOLUTION: The semiconductor power module 110 comprises DC terminals 111a, 111b to be connected to a capacitor module 200. The semiconductor power module 110 is used in combination with a waterway body 101 for cooling. The DC terminals 111a, 111b protrude toward the capacitor module 200 beyond the waterway body 101.;COPYRIGHT: (C)2011,JPO&INPIT