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Double-headed grinding method of double-headed grinding apparatus and work

机译:双头研磨装置的双头研磨方法及工作

摘要

The invention is directed to a double-disc grinding apparatus including: a rotatable ring holder configured to support a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece; a pair of grinding wheels for grinding surfaces of the workpiece supported by the ring holder; and a hydrostatic bearing for supporting the ring holder without contact from both of a direction of a rotational axis of the ring holder and a direction perpendicular to the rotational axis by hydrostatic pressure of fluid supplied from both directions, wherein supply pressures at which the fluid is supplied from the direction of the rotational axis and from the direction perpendicular to the rotational axis can be independently controlled. The invention provides a double-disc grinding apparatus and a workpiece double-disc grinding method that can improve variation in nanotopography depending on the lot of workpieces or grinding wheels to obtain nanotopography stably.
机译:本发明涉及一种双盘磨削装置,该双盘磨削装置包括:旋转环保持器,其构造成从工件的外周侧沿周向支撑片状工件。一对砂轮,用于研磨由环形支架支撑的工件的表面;以及一种静压轴承,其通过从两个方向供应的流体的静压力而不受环形支撑器的旋转轴线的方向和垂直于旋转轴线的两个方向的支撑而支撑环形保持器。可以独立地控制从旋转轴的方向和垂直于旋转轴的方向供给的电流。本发明提供了一种双盘磨削装置和工件双盘磨削方法,其能够根据工件或砂轮的数量来改善纳米形貌的变化,从而稳定地获得纳米形貌。

著录项

  • 公开/公告号JP5724958B2

    专利类型

  • 公开/公告日2015-05-27

    原文格式PDF

  • 申请/专利权人 信越半導体株式会社;

    申请/专利号JP20120149203

  • 发明设计人 小林 健司;

    申请日2012-07-03

  • 分类号B24B7/17;B24B41/06;H01L21/304;

  • 国家 JP

  • 入库时间 2022-08-21 15:30:03

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