首页> 外国专利> Waveguide , the optical waveguide module using a method of manufacturing the optical waveguide and the optical waveguide .

Waveguide , the optical waveguide module using a method of manufacturing the optical waveguide and the optical waveguide .

机译:波导中,使用光波导模块的方法制造光波导和光波导。

摘要

PROBLEM TO BE SOLVED: To provide an optical waveguide in which the occurrence of a dent or a distortion when performing cutting work of the optical waveguide made of a low-modulus material can be suppressed and a value of light propagation loss, particularly mirror reflection loss, is reduced by suppressing cutting trace generated on a cutting surface, and to provide a method for manufacturing the optical waveguide and an optical waveguide module with the optical waveguide.;SOLUTION: An optical waveguide includes a core layer and a clad layer made of resin having an elastic modulus of 300 MPa or less, and at least the core layer is laminated on the clad layer. The core layer or the core layer and the clad layer have a cutting surface formed by performing cutting work with a circular rotary blade having multiple non-cutting blade parts and multiple cutting blade parts on the outer circumference thereof. A ratio of the sum of length of the multiple non-cutting blade parts to the sum of length of the multiple cutting blade parts in an outer circumference direction of the circular rotary blade (the sum of length of the non-cutting blade parts/the sum of length of the cutting blade parts) is within the range of 1/8 to 2/3.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种光波导,其中,在对由低模量材料制成的光波导进行切割加工时,可以抑制凹痕或变形的发生,并且可以抑制光的传播损耗,特别是镜面反射损耗的值。通过抑制在切割表面上产生的切割痕迹来减少光的损耗,并提供一种制造光波导的方法以及具有该光波导的光波导模块。解决方案:光波导包括由树脂制成的芯层和包层。具有至少300MPa的弹性模量,并且至少芯层被层压在覆盖层上。芯层或芯层和包覆层具有通过用圆形旋转刀片进行切割加工而形成的切割表面,该圆形旋转刀片在其外周上具有多个非切割刀片部分和多个切割刀片部分。多个非切割刀片部分的长度之和与多个切割刀片部分的长度之和在圆形旋转刀片的外周方向上的比(非切割刀片部分的长度之和/刀片长度的总和)在1/8至2/3范围内;版权:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP5671943B2

    专利类型

  • 公开/公告日2015-02-18

    原文格式PDF

  • 申请/专利权人 日立化成株式会社;

    申请/专利号JP20100245430

  • 发明设计人 八木 成行;黒田 敏裕;

    申请日2010-11-01

  • 分类号G02B6/13;G02B6/122;

  • 国家 JP

  • 入库时间 2022-08-21 15:29:35

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