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Copper-based brazing filler metal.

机译:铜基钎料。

摘要

PROBLEM TO BE SOLVED: To provide a copper brazing filler metal that can keep high joining strength even when there is a variation in the surface conditions of a joined face like a green compact and a sintered body.;SOLUTION: The copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance copper (Cu) with inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content to the Mn content (i.e., (Ni content)/(Mn content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种即使在生坯和烧结体等接合面的表面条件发生变化时也能保持高接合强度的铜钎料;解决方案:铜钎料包括Ni为20质量%以上36质量%以下,Mn为19质量%以上30质量%以下,Fe为0质量%以上16质量%以下, Si的含量大于0(不包括端值)至2质量%或更小,B的含量大于0.1至0.5质量%或更小,余量的铜(Cu)具有不可避免的杂质和/整体为100质量%时,则为修饰元素或修饰元素。另外,铜钎料中,当不含Fe时,其Ni含量与Mn含量之比((Ni含量)/(Mn含量))在1.1以上2以下的范围内。 。;版权:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP5729276B2

    专利类型

  • 公开/公告日2015-06-03

    原文格式PDF

  • 申请/专利权人 株式会社豊田中央研究所;

    申请/专利号JP20110261568

  • 发明设计人 大島 正;伊東 一彦;高尾 尚史;

    申请日2011-11-30

  • 分类号B23K35/30;C22C9/05;C22C9/06;B23K35/40;B23K1/19;B22F7/06;C22F1/00;C22F1/08;B22F3/10;B23K103/02;

  • 国家 JP

  • 入库时间 2022-08-21 15:29:12

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