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Resin supply apparatus and the electronic component molding apparatus comprising the same, and a resin supply method.
Resin supply apparatus and the electronic component molding apparatus comprising the same, and a resin supply method.
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机译:树脂供给装置和包括该树脂供给装置的电子部件成型装置以及树脂供给方法。
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摘要
[PROBLEMS] It is an primary object, the resin supply device and a resin supply methods may be an electronic component molding apparatus is laid compactly the entire electronic component molding apparatus even while having at least two press, and can be compact is, the present invention is to provide an electronic component molding apparatus provided with the resin feeder. A resin supply apparatus according to the invention at least comprises at least two press, and each of the lower die and a pair of upper mold corresponding to the pressing of at least two press, provided in the lower die a resin supplying apparatus used in an electronic component molding apparatus for multi-press type for performing transfer molding resin by supplying the liquid resin on one of the lower mold in the pot.BACKGROUND 4.
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