首页> 外国专利> Plating conductive substrate , a method of producing the preparation and conductive layers patterned substrate using the same conductor layer patterned substrate , translucent electromagnetic shielding member

Plating conductive substrate , a method of producing the preparation and conductive layers patterned substrate using the same conductor layer patterned substrate , translucent electromagnetic shielding member

机译:电镀导电基板,其制备方法以及使用该导电层的图案化基板的导电层图案化基板,半透明电磁屏蔽构件

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a conductive base material for plating, by which a base material with a conductor pattern patterned so as to have conductivity and light transmitting property can be produced at high productivity by using a transfer method, while, furthermore, the conductive base material for plating can be easily prepared.;SOLUTION: A method for producing a conductive base material for plating includes the steps of: (A) forming a removable protruded pattern (6) on the surface of a conductive base material (2); (B) forming an insulation layer (7) made of diamond-like carbon (DLC) or an inorganic material on the surface of the conductive base material on which the removable protruded pattern is formed; and (C) removing the protruded pattern to which the insulation layer is attached.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种用于制造电镀用导电性基材的方法,通过该方法,可以通过使用转印方法以高生产率生产具有被图案化以具有导电性和透光性的导体图案的基材。解决方案:一种用于电镀的导电性基材的制造方法包括以下步骤:(A)在导电性基材的表面上形成可去除的凸起图案(6)。材料(2); (B)在形成有可去除突起图案的导电性基材的表面上形成由类金刚石碳(DLC)或无机材料构成的绝缘层(7)。 COPYRIGHT:(C)2014,JPO&INPIT;和(C)去除附着绝缘层的突出图案。

著录项

  • 公开/公告号JP5626419B2

    专利类型

  • 公开/公告日2014-11-19

    原文格式PDF

  • 申请/专利权人 日立化成株式会社;

    申请/专利号JP20130136633

  • 发明设计人 直之 進;鈴木 恭介;登坂 実;

    申请日2013-06-28

  • 分类号H05K9/00;G09F9/00;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:27

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