首页> 外国专利> Optical film thickness measurement apparatus and the optical film thickness measuring apparatus thin film forming apparatus using the

Optical film thickness measurement apparatus and the optical film thickness measuring apparatus thin film forming apparatus using the

机译:光学膜厚测定装置及使用该光学膜厚测定装置的光学膜厚测定装置的薄膜形成装置

摘要

Without using the monitor substrate is measured directly with the thickness of the product in real time and to provide an optical film thickness measuring apparatus for measuring with high precision. Optical film thickness measuring device includes a light projecting unit, a light receiving section, and an internal beam splitter in the plurality of base holding means for reflecting the measurement light to the substrate, from the nearest inside the beam splitter out of the plurality of internal beam splitter and an internal light reflecting member the measuring light is totally reflected, toward a plurality of external beam splitter for reflecting the light receiving unit measuring light from a plurality of internal beam splitter, the measurement light from the light reflecting member to the light receiving part reflection It has an external light reflection member. The measurement light reflected by the internal beam splitter and internal light reflection member, after it was transmitted through the substrate, leading to the light receiving portion can be reflected by external beam splitter and an external light reflecting member, for receiving the measurement light.
机译:不使用监视器基板就可以直接实时地测量产品的厚度,从而提供了一种用于高精度测量的光学膜厚测量装置。光学膜厚测定装置在多个基体保持机构中具有投光部,受光部和内部分束器,该内部分束器从多个分束器中的最靠近分束器的内部将测定光反射至基板。分束器和内部光反射部件,使测量光全反射,朝向多个外部分束器反射,以反射光接收单元,测量来自多个内部分束器的光,测量光从光反射部件射向光接收器部分反射它具有外部光反射部件。由内部光束分离器和内部光反射构件反射的测量光在穿过基板之后,通向光接收部分,可以被外部光束分离器和外部光反射构件反射,以接收测量光。

著录项

  • 公开/公告号JPWO2013121546A1

    专利类型

  • 公开/公告日2015-05-11

    原文格式PDF

  • 申请/专利权人 株式会社シンクロン;

    申请/专利号JP20120538014

  • 发明设计人 佐井 旭陽;姜 友松;小澤 健二;

    申请日2012-02-15

  • 分类号G01B11/06;C23C14/52;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:15

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