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Epoxy resin composition and an epoxy resin / polyether sulfone complex

机译:环氧树脂组合物和环氧树脂/聚醚砜络合物

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which achieves the toughness of its cured product and which is more improved in adhesion workability than a conventional epoxy resin composition that has the same PES ratio as the epoxy resin composition and that is obtained by blending the cured product after dissolving an epoxy resin and PES.;SOLUTION: In the epoxy resin composition having the epoxy resin, the curing agent and polyethersulfone, the mass ratio of the epoxy resin to the polyethersulfone is 80:20 to 40:60. The epoxy resin composition is a liquid composition 1 in which solid particle-type polyethersulfone 3 is dispersed in a liquid epoxy resin 2. Moreover, in a cured product 10 obtained by curing the liquid composition, polyethersulfone serves as a matrix 11. The cured product 10 takes on a matrix-domain phase structure in which a domain 12 of the epoxy resin is dispersed in the matrix 11.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种环氧树脂组合物,该环氧树脂组合物实现了其固化产品的韧性,并且与具有与所述环氧树脂组合物相同的PES比并通过共混获得的常规环氧树脂组合物相比,其粘合可加工性得到了更大的改善溶解环氧树脂和PES后的固化产物。;解决方案:在具有环氧树脂,固化剂和聚醚砜的环氧树脂组合物中,环氧树脂与聚醚砜的质量比为80:20至40:60。环氧树脂组合物是在液体环氧树脂2中分散有固体颗粒型聚醚砜3的液体组合物1。此外,在通过固化该液体组合物而获得的固化物10中,聚醚砜用作基质11。图10呈现的是基质-畴相结构,其中环氧树脂的畴12分散在基质11中。;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP5630182B2

    专利类型

  • 公开/公告日2014-11-26

    原文格式PDF

  • 申请/专利权人 株式会社デンソー;

    申请/专利号JP20100215689

  • 发明设计人 加藤 寛;奥平 浩之;杉浦 昭夫;

    申请日2010-09-27

  • 分类号C08G59/50;C08L63/00;C08L81/06;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:04

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