首页> 外国专利> Forming a fine pattern for the radiation-curable resin composition , and a method of manufacturing a microstructure using said composition

Forming a fine pattern for the radiation-curable resin composition , and a method of manufacturing a microstructure using said composition

机译:形成用于辐射固化性树脂组合物的精细图案,以及使用所述组合物制造微结构的方法

摘要

PROBLEM TO BE SOLVED: To realize a simple method of manufacturing a fine structure, that collectively forms a fine pattern on a large sized base material while having a high throughput, in a method of forming the fine pattern by irradiation with radiation, and to provide a radiation curable resin composition for forming a fine pattern, capable of obtaining a uniform painted film producing no interference fringe after forming the pattern.;SOLUTION: This radiation curable resin composition has: a radiation-sensitive curable polymer (P) having an alkylene group, an arylene group, -COO-, and the like, and a unit comprising a radiation curable functional group, a cyclic ether group, and the like; a radiation curable monomer (M); and a radiation polymerization initiator (I). The rate of the radiation-sensitive curable polymer (P) to a total quantity of radiation curable components in the composition is 55-95 wt.%, and the rate of the radiation curable monomer (M) is 5-45 wt.%.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:为了实现一种制造精细结构的简单方法,该方法通过在用放射线照射形成精细图案的方法中,以高生产率同时在大型基材上共同形成精细图案,并提供用于形成精细图案的辐射固化性树脂组合物,能够在形成图案后获得均匀的涂膜而不会产生干涉条纹。解决方案:该辐射固化性树脂组合物具有:具有亚烷基的辐射敏感性固化性聚合物(P)。 ;亚芳基,-COO-等,以及包含可辐射固化的官能团,环醚基等的单元;可辐射固化单体(M);和辐射聚合引发剂(I)。放射线敏感性固化性聚合物(P)相对于组合物中的放射线固化性成分总量的比例为55〜95重量%,放射线固化性单体(M)的比例为5〜45重量%。 ;版权:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP5634799B2

    专利类型

  • 公开/公告日2014-12-03

    原文格式PDF

  • 申请/专利权人 株式会社ダイセル;

    申请/专利号JP20100189475

  • 发明设计人 三宅 弘人;伊吉 就三;

    申请日2010-08-26

  • 分类号H01L21/027;G11B7/24;G11B7/26;C08F22/20;C08G59/02;B29C59/02;

  • 国家 JP

  • 入库时间 2022-08-21 15:27:43

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