FORMING CONDUCTIVE PATTERN USING TITANIA SOL-GEL

摘要

A conductive metal pattern is formed using a layer of a titania sol-gel formed from a titania precursor composition of (a) a titanium alkoxide or titanium aryloxide, (b) R(O)_mCOCH₂CO(O)_nR′ wherein R and R′ are independently alkyl having at least 1 carbon atom, and m and n are independently 0 or 1, (c) water, (d) either an acid having a pK_a less than 1 or a source of a halogen, and (e) a water-miscible organic solvent, on a substrate, to form a layer of a titania sol-gel on the substrate. The layer is contacted with electroless seed metal ions to provide a layer of electroless seed metal ions, imagewise exposed to form non-exposed regions and exposed regions. The electroless seed metal ions in the non-exposed regions are removed and the electroless seed metal nuclei within the titania sol-gel in the exposed regions are then electrolessly plated with a conductive metal.