THERMAL ENERGY STORAGE, DISSIPATION AND EMI SUPPRESSION FOR INTEGRATED CIRCUITS USING POROUS GRAPHITE SHEETS AND PHASE CHANGE MATERIAL

摘要

Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.