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PHOTOSINTERING OF MICRON-SIZED COPPER PARTICLES
PHOTOSINTERING OF MICRON-SIZED COPPER PARTICLES
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机译:微米级铜颗粒的光烧结
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摘要
Micron-sized metal particles in an ink or paste composition are deposited onto a substrate and then photosimered. The substrate may comprise a polymeric material. The polymeric substrate may have a coefficient of thermal expansion greater than two times the coefficient of thermal expansion of the photosimered ink or paste composition.
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