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CROSSLINKABLE HALOGEN-FREE RESIN COMPOSITION, CROSSLINKED MOLDED ARTICLE, INSULATED WIRE AND CABLE

机译:无交联的不含卤素的树脂组合物,交联的模制品,绝缘的电线和电缆

摘要

A crosslinkable halogen-free resin composition includes a base polymer including at least one type of ethylene-vinyl acetate copolymer (EVA) and an acid-modified polyolefin resin having a glass-transition temperature (Tg) as measured by DSC of not more than −55° C. at a mass ratio of 70:30 to 99:1, and a metal hydroxide included in an amount of 100 to 250 parts by mass per 100 parts by mass of the base polymer. The at least one type of EVA has a melting temperature (Tm) as measured by DSC of not less than 70° C. The base polymer includes 25 to 50 mass % of a vinyl acetate (VA).
机译:可交联的无卤素树脂组合物包括基础聚合物,所述基础聚合物包括至少一种乙烯-乙酸乙烯酯共聚物(EVA)和通过DSC测量的玻璃化转变温度(Tg)不大于-的酸改性聚烯烃树脂。在55℃下以70:30至99:1的质量比,相对于100质量份基础聚合物,金属氢氧化物的含量为100至250质量份。至少一种类型的EVA具有通过DSC测量的不低于70℃的熔融温度(Tm)。基础聚合物包括25至50质量%的乙酸乙烯酯(VA)。

著录项

  • 公开/公告号US2015030853A1

    专利类型

  • 公开/公告日2015-01-29

    原文格式PDF

  • 申请/专利权人 HITACHI METALS LTD.;

    申请/专利号US201414327471

  • 发明设计人 MITSURU HASHIMOTO;MAKOTO IWASAKI;

    申请日2014-07-09

  • 分类号H01B3/44;H01B3/02;H01B7/295;C08L31/04;

  • 国家 US

  • 入库时间 2022-08-21 15:21:47

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