首页> 外国专利> SENSOR COMPONENT FOR A GAS AND/OR LIQUID SENSOR, PRODUCTION METHOD FOR A SENSOR COMPONENT FOR A GAS AND/OR LIQUID SENSOR, AND METHOD FOR DETECTING AT LEAST ONE MATERIAL IN A GASEOUS AND/OR LIQUID MEDIUM

SENSOR COMPONENT FOR A GAS AND/OR LIQUID SENSOR, PRODUCTION METHOD FOR A SENSOR COMPONENT FOR A GAS AND/OR LIQUID SENSOR, AND METHOD FOR DETECTING AT LEAST ONE MATERIAL IN A GASEOUS AND/OR LIQUID MEDIUM

机译:气体和/或液体传感器的传感器组件,气体和/或液体传感器的传感器组件的制造方法以及在气态和/或液体介质中至少一种材料的检测方法

摘要

A sensor component is described for a gas and/or liquid sensor having a substrate having at least one first printed conductor and a second printed conductor, which are fashioned such that a voltage can be applied, and having at least one sensitive semiconductor material, additionally including at least one trench a contact segment of the first printed conductor and a contact segment of the second printed conductor being situated on two inner side surfaces at a distance from one another, and the at least one sensitive semiconductor material being filled into the at least one trench in the form of at least one particle, grain, and/or crystal, at least between the first contact segment of the first printed conductor and the first contact segment of the second printed conductor. Also described is a production method for a sensor component for a gas and/or liquid sensor. In addition, also described is a method for detecting at least one material in a gaseous and/or liquid medium.
机译:描述了一种用于气体和/或液体传感器的传感器部件,该传感器部件具有基板,该基板具有至少一个第一印刷导体和第二印刷导体,其被构造成使得可以施加电压并且还具有至少一种敏感的半导体材料。包括至少一个沟槽,第一印刷导体的接触段和第二印刷导体的接触段位于彼此间隔一定距离的两个内侧表面上,并且至少一种敏感半导体材料被填充到至少一个沟槽中。至少在第一印刷导体的第一接触段和第二印刷导体的第一接触段之间具有至少一种颗粒,晶粒和/或晶体形式的沟槽。还描述了用于气体和/或液体传感器的传感器部件的生产方法。另外,还描述了一种用于检测气态和/或液态介质中的至少一种材料的方法。

著录项

  • 公开/公告号US2015000376A1

    专利类型

  • 公开/公告日2015-01-01

    原文格式PDF

  • 申请/专利权人 RICHARD FIX;BERND SCHUMANN;

    申请/专利号US201414313569

  • 发明设计人 RICHARD FIX;BERND SCHUMANN;

    申请日2014-06-24

  • 分类号G01N27/04;H01L21/304;H01L29/12;H01L21/02;G01N27/06;G01N33;

  • 国家 US

  • 入库时间 2022-08-21 15:21:36

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