首页>
外国专利>
Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof
Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof
A method of and the device for making a LED assembly that contains regionally rigid structures that are made by bending, folding, or forming a flexible hybrid heat spreading laminate is provided. The hybrid heat spreading laminate comprises a thin heat spreader layer in the range of 100-150 micrometers. The hybrid heat spreading laminate has enhanced heat conductivity and thermal emissivity.
展开▼