首页> 外国专利> Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof

Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof

机译:通过并入,扩展,弯曲或形成上述组合的电路在电路内部形成加强结构而使用具有散热层并在这种结构中硬化特定区域的柔性电路

摘要

A method of and the device for making a LED assembly that contains regionally rigid structures that are made by bending, folding, or forming a flexible hybrid heat spreading laminate is provided. The hybrid heat spreading laminate comprises a thin heat spreader layer in the range of 100-150 micrometers. The hybrid heat spreading laminate has enhanced heat conductivity and thermal emissivity.
机译:提供了一种用于制造LED组件的方法和装置,该LED组件包括通过弯曲,折叠或形成柔性混合散热层压板而制成的区域刚性结构。混合散热层压板包括在100-150微米范围内的薄散热层。混合散热层压板具有增强的导热率和热发射率。

著录项

  • 公开/公告号US9117991B1

    专利类型

  • 公开/公告日2015-08-25

    原文格式PDF

  • 申请/专利权人 FLEXTRONICS AP LLC;

    申请/专利号US201313763214

  • 发明设计人 KEVIN BUERMANN;BRUCE OLSON;SHAUN SHEEHAN;

    申请日2013-02-08

  • 分类号H01L33/64;

  • 国家 US

  • 入库时间 2022-08-21 15:20:35

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