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MODIFIED MICROGRINDING PROCESS

机译:改进的微粉磨工艺

摘要

pA method of forming a substrate is performed by grinding a substrate using abrasives so that both major surfaces of the substrate achieve desired flatness, smoothness , or both. In an embodiment ,a coarser abrasive is used to grind one major surface , while a finer abrasive is simultaneously used to grind the other major surface. A single grinding step can used to produce a substrate having opposing surfaces of different surface roughnesses. This may help to eliminate a typical second downstream fine polishing step used in the prior art. Embodiments can be used with a wide variety of substrates, including sapphire, silicon carbide and gallium nitride single crystal structures grown by various techniques./p
机译:>形成基板的方法是通过使用磨料研磨基板以使基板的两个主表面都达到期望的平坦度,平滑度或两者而进行的。在一个实施例中,使用较粗的研磨剂来研磨一个主表面,而同时使用较细的研磨剂来研磨另一主表面。单个研磨步骤可用于生产具有不同表面粗糙度的相对表面的基材。这可以帮助消除现有技术中使用的典型的第二下游精细抛光步骤。实施例可以与各种各样的衬底一起使用,包括通过各种技术生长的蓝宝石,碳化硅和氮化镓单晶结构。

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