A method of preparing pre-soldered and pre-molded sensor strain gauge for measurement of applied stress on a component comprising the steps of placing a sensor gauge (1) on a glass bottom (2) on covering the whole face of the gauge by double sided tape (3), placing around the tape covered strain gauge (1) a O-ring (4), soldering the open ends of a 25 pin connected male connector cable (5) to the soldering tabs (6) of the strain gauge and completely molding the strain gauge along the space between the gauge and the O-ring with a suitable agent and allowing the agent to get set and installing the said soldered and molded sensor strain gauge on the surface of a component by a suitable adhesive at any location for measurement of applied strain on the component.
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