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A method of simulating radiation heat transfer from one radiating surface to another

机译:模拟从一个辐射面到另一个辐射面的辐射热传递的方法

摘要

Abstract The present invention relates to systems and methods of simulating radiation heat transfer in Finite Element Analysis. The present invention provides a method of simulating radiation heat transfer between a first radiating surface and a second radiating surface of a structure in a finite element analysis. The method comprising making a Finite Element Model of the structure, determining average temperature of first and second radiating surfaces, defining first node, second node, third node, fourth node and transferring the average temperature of the first and second radiating surface to the first node and third node respectively, transferring temperature of the first node and third node to second node and fourth node respectively, simulating the radiation heat transfer from the node to the radiating surfaces and performing the finite element analysis. The present invention also provides a system for performing the method of the present invention. FIG. 2
机译:摘要本发明涉及在有限元分析中模拟辐射热传递的系统和方法。本发明提供了一种在有限元分析中模拟结构的第一辐射表面和第二辐射表面之间的辐射热传递的方法。该方法包括:对该结构进行有限元模型;确定第一和第二辐射面的平均温度;定义第一节点,第二节点,第三节点,第四节点;以及将第一和第二辐射面的平均温度传递到第一节点。第一节点和第三节点分别将第一节点和第三节点的温度传递给第二节点和第四节点,以模拟从节点到辐射面的辐射热传递并进行有限元分析。本发明还提供一种用于执行本发明的方法的系统。图。 2

著录项

  • 公开/公告号IN2013CH04761A

    专利类型

  • 公开/公告日2015-04-24

    原文格式PDF

  • 申请/专利权人 INFOTECH ENTPR LTD;

    申请/专利号IN2013CHE4761

  • 发明设计人 SURESH CHERUKUPALLI;KRISHNA NELANTI;

    申请日2013-10-22

  • 分类号G06F;

  • 国家 IN

  • 入库时间 2022-08-21 15:14:11

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