首页> 外国专利> QUASI-OMNIDIRECTIONAL ANTI-REFLECTIVE STRUCTURE BASED ON POROUS SILICON DIELECTRIC MULTILAYERS FOR THE NEAR INFRARED, VISIBLE AND MIDDLE ULTRAVIOLET REGION OF THE ELECTROMAGNETIC SPECTRUM

QUASI-OMNIDIRECTIONAL ANTI-REFLECTIVE STRUCTURE BASED ON POROUS SILICON DIELECTRIC MULTILAYERS FOR THE NEAR INFRARED, VISIBLE AND MIDDLE ULTRAVIOLET REGION OF THE ELECTROMAGNETIC SPECTRUM

机译:基于多孔硅介电多层层的准全向反折射结构,用于电磁光谱的近红外,可见和中紫外区域

摘要

The invention relates to an antireflective structure based on porous silicon multilayers stacked in a one-dimensional manner. This layer can reflect less than 4% of incident light at any angle, i.e. it is not dependent on the position in which it is oriented. This is achieved for a wavelength range from 200 nm to 2000 nm and with a total physical thickness of only 510 nm. The structure comprises 51 layers having gradual porosity values ranging from 92 to 38 %. The length of each layer is constant and equal to 10 nm and the profile of the refractive index varies by means of a monotonically increasing envelope function of the form f(z)=n0+(nF-n0)(z/L)k,with z the depth of the layer. The device is made using electrochemical anodization in an electrolytic solution of hydrofluoric acid and ethanol, attacking silicon wafers in a galvanostatic manner in a controlled interface.
机译:本发明涉及基于一维堆叠的多孔硅多层的抗反射结构。该层可以在任何角度反射少于4%的入射光,即它不依赖于其定向的位置。这是在200 nm至2000 nm的波长范围内实现的,而总物理厚度仅为510 nm。该结构包括51个层,这些层的孔隙度值为92%至38%。每层的长度是恒定的,等于10 nm,并且折射率的分布借助于 f(z)= n 形式的单调递增包络函数而变化0 +(n F -n 0 )(z / L) k, ,其中z为图层的深度。该设备是在氢氟酸和乙醇的电解液中使用电化学阳极氧化工艺制成的,在受控界面中以恒电流方式侵蚀硅片。

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