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WATER VAPOR REFLOW DEVICE AND WATER VAPOR REFLOW METHOD

机译:水蒸气回流装置及水蒸气回流方法

摘要

The purpose of the present invention is to provide a water vapor reflow device and water vapor reflow method that use superheated water vapor and that make practical use possible. A water vapor reflow device (1) provided with a heating furnace (2) having a preheating zone (Z2), a soaking zone (Z3), a melting zone (Z4), and a cooling zone (Z5), to each of which heated water vapor is supplied, wherein a furnace exit-side condensation prevention zone (Z6) and a furnace entrance-side condensation prevention zone (Z1) to which air or nitrogen gas heated by a heater (H1) to 100°C or higher is fed are respectively provided adjacent to the downstream of the cooling zone (Z5)and to the upstream of the preheating zone (Z2) to which superheated water vapor is fed. When a substrate (S) enters the heating furnace (2), and when the substrate (S) exits the heating furnace (2), the water vapor that has come into contact with the substrate (S) can be prevented from falling to 100°C or lower, liquefying, and condensing, and therefore a practicable water vapor reflow can be realized.
机译:发明内容本发明的目的是提供一种使用过热水蒸气并且可以实际使用的水蒸气回流装置和水蒸气回流方法。一种水蒸气回流装置(1),其具有加热炉(2),所述加热炉具有预热区(Z2),均热区(Z3),熔融区(Z4)和冷却区(Z5),供给加热后的水蒸气,其中,在加热器出口(H1)加热至100℃以上的空气或氮气在炉出口侧防冷凝区(Z6)和炉入口侧防冷凝区(Z1)中流通。分别在冷却区(Z5)的下游和预热区(Z2)的上游提供过热的水蒸气。当基材(S)进入加热炉(2)时,以及基材(S)离开加热炉(2)时,可以防止与基材(S)接触的水蒸气下降至100℃。 ℃或更低,液化和冷凝,因此可以实现实用的水蒸气回流。

著录项

  • 公开/公告号WO2014203499A1

    专利类型

  • 公开/公告日2014-12-24

    原文格式PDF

  • 申请/专利权人 SSTECHNOINC.;KNE KABUSHIKIKAISHA;

    申请/专利号WO2014JP03118

  • 发明设计人 OYAMA KENSHU;NAGAO KAZUHIDE;

    申请日2014-06-11

  • 分类号B23K1/008;B23K1/012;B23K3/04;B23K31/02;H05K3/34;B23K101/42;

  • 国家 WO

  • 入库时间 2022-08-21 15:09:26

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