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PLATING APPARATUS AND PLATING METHOD FOR SOLAR CELL SUBSTRATE, IN WHICH ELECTROPLATING AND LIGHT-INDUCED PLATING ARE SIMULTANEOUSLY PERFORMED
PLATING APPARATUS AND PLATING METHOD FOR SOLAR CELL SUBSTRATE, IN WHICH ELECTROPLATING AND LIGHT-INDUCED PLATING ARE SIMULTANEOUSLY PERFORMED
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机译:同时进行电镀和光诱导电镀的太阳能电池基材的电镀设备和电镀方法
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摘要
The present invention relates to plating equipment and method for a solar cell wafer using electroplating and light-induced plating jointly. The plating equipment includes a jig allowing a wafer (1), that is a body to be plated, to be vertically immersed into a plating solution at a center of a plating bath(209), a first plating unit (200) comprising a plurality of anode members (210) symmetrically disposed on both sides of the plating bath (209) facing the wafer (1), the first plating unit performing electroplating; and a second plating unit (300) disposed in a light source receiving unit (320) physically blocked from the first plating unit (200), the second plating unit (300) being disposed at a rear side of the anode members(210) to perform light-induced plating by using an light emitting diode (LED) lamp (301) irradiating light onto the wafer (1).
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