HIGH PURITY REFRACTORY METAL SPUTTERING TARGETS WHICH HAVE A UNIFORM RANDOM TEXTURE MANUFACTURED BY HOT ISOSTATIC PRESSING HIGH PURITY REFRACTORY METAL POWDERS

摘要

A method for making a sputtering target including steps of encapsulating and hot isostaticallly pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 µm, with at least about 10 percent by weight of particles having a particle size greater than about 150 µm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 µm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.