Semiconductor device with a bonding layer with a region comprising Ti and a region comprising Sn but with substantially no region comprising both Ti and Sn and method for manufacturing the same

摘要

According to one embodiment, a semiconductor device (110) includes a semiconductor element (20), a mounting member (70) including Cu, and a bonding layer (50) provided between the semiconductor element (20) and the mounting member (70). The bonding layer (50) includes a first region (R1) including Ti and Cu, and a second region (R2) provided between the first region (R1) and the mounting member (70), and including Sn and Cu. A first position (P1) along the first direction is positioned between the semiconductor element (20) and a second position (P2) along the first direction. The first position (P1) is where the composition ratio (51r) of Ti in the first region (R1) is 0.1 times a maximum value (51x) of the composition ratio (51r) of Ti. The second position (P2) is where the composition ratio (52r) of Sn in the second region (R2) is 0.1 times a maximum value (52x) of the composition ratio (52r) of Sn. A distance (L1) between the first position (P1) and the second position (P2) is not less than 0.1 micrometres.According to another embodiment, a semiconductor device (120) includes a semiconductor element (20), a mounting member (70) including Cu, a first layer (41) provided between the semiconductor element (20) and the mounting member (70), the first layer (41) including Ti, a second layer (42) provided between the first layer (41) and the mounting member (70), the second layer (42) including Sn and Cu and a third layer (43) provided between the first layer (41) and the second layer (42), the third layer (43) including at least one selected from Ni, Pt, and Pd.In both embodiments, the semiconductor device (110, 120) is formed by bonding the semiconductor element (20) to the mounting member (70) by solid solution bonding.Thereby, a semiconductor device (110, 120) having good heat dissipation and high productivity can be provided.