A HALOGEN-FREE COMPOSITE-BASE CEM-3 COPPER CLAD LAMINATE AND PREPARATION METHOD THEREOF

摘要

The present invention discloses a kind of halogen-free composite-base CEM-3 copper clad laminate (CLL) and its preparation method. In the halogen-free composite-base CEM-3 copper clad laminate, compositions of organic and inorganic fillers are used for both the core material and surface material, and adicyandiamide and diamino diphenyl sulfone compound amine curing agent is employed. The prepared halogen-free flame-resistant copper clad laminate reaches a balance of each performance and has high CTI and heat resistance and good punching processability and alkali resistance. The prepared halogen-free flame-resistant copper clad laminate has CTI performance of 600V, thermal delamination time T288 of 30min, thermal decomposition temperature Td of 340°C, 288°C soldering time of 300s, thereby it meets the requirements of lead-free process.