GRAPHENE COATING WITH EXCELLENT ADHESION TO THE HEAT SINK FOR SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING

摘要

According to the present invention, a heat sink for a semiconductor package having the excellent adhesion of graphene coating, and a manufacturing method thereof are capable of improving the adhesion of a graphene coating layer by forming the graphene coating layer after forming a blackening processing film on a surface of the heat sink manufactured by: a base preparation step (S10) of placing a base metal (10) on a press mold; a press step (S20) of applying press processing to the base metal (10) in a preset shape; a chrome separating and heating step (S30) of separating carbon (C) and chrome (Cr) formed in stainless by heating the base metal (10) at 1100°C or greater; a chrome oxidation reaction step (S40) of forming the chrome (Cr) separated from a surface of the base metal (10) into oxidation chrome (Cr_2 O_3) by making the press metal (10) touch decomposition gas (G) formed of nitrogen (N) and hydrogen (H); a blackening processing film step (S50) of oxidizing and extracting the surface of the base metal (10) with the oxidation chrome (Cr_2 O_3); and a graphene coating step (S60) of forming the graphene coating layer (30) by applying graphene solution (Y) containing carbon to an outer surface of the blackening processing film (20).