JOINING OF HTS 2G COATED CONDUCTOR USING ULTRASONIC WELDING METHOD

摘要

The present invention relates to a method of bonding a 2 generation high temperature superconducting wire rod including a substrate, a buffer layer, a superconducting layer, and a stabilization layer, in which ends of 2 generation high temperature superconducting wire rods to be bonded overlap with each other or meet each other for the ultrasonic welding work. The present invention suggests a low resistance and high strength bonding method and a low resistance and high strength bonding apparatus in which ultrasonic vibration is applied in the state that a predetermined pressure is applied, so that the interfacial surface bonding between metals (Cu layers) to surround a CC conductor having a multi-structure is possible in a solid state. Without a soldering scheme employing lead or a welding filler in the related art, an electrical characteristic such as the deterioration of critical current caused by mechanical damage expected in the bonding part between the superconducting wire rods can be prevented, and a lower contact resistance and superior strength can be represented as compared with a soldering bonding part. In addition, the present invention relates to a technology allowing the formation of a bonding part of a CC conductor through the ultrasonic welding work even if the surface of the CC conductor includes metal difficult to be applied to a soldering work. Accordingly, the method of bonding the 2 generation high temperature superconducting wire rod through the ultrasonic welding scheme can be used when the ultrasonic welding technology is applied to a process of forming a bonding part in order to make a single CC conductor to a long wire rod, a bonding part welded for an electrical connection bonding between a high-temperature superconducting coil formed by winding a wire rod and a magnetic coil is formed, and a continuous ultrasonic welding work is performed to form a stacked CC conductor.