There is provided a kind of modified oxidized metallic particles in the surface by metal oxide particle material surface modifying to contain average primary particle diameter is 3-10 nanometers (including end value), with crosslinkable groups is phenyl and polyorganosiloxane resin forming member with functional group with surface modifying material. The modified metal oxide particle situation in the surface shows the modified metal oxide particle material in high heat resistance surface as encapsulating material optical semiconductor light emitting devices etc., while showing the highest tolerance barrier property seen when the high grade of transparency and drilling. It also provides: dispersion liquid, organosilicon resin composition and organic siliconresin complex, each metal oxide particle material modified comprising surface; With light luminescent device, lighting device and liquid crystal image-forming devices, each of them is use silicone resin complex.
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