APPARATUS FOR BONDING DIES AND METHOD OF BONDING DIES USING THE APPARATUS

摘要

An apparatus for bonding dies may include a wafer stage which supports a wafer having a sawed die shape and is horizontally moved to pick up dies in a first position and a second position; a die stage which is formed above the wafer stage to be moved between a first position and an avoiding position, which is not the first position, is located in the first position when picking up the dies in the second position, and is located in the avoiding position when picking up the dies in the first position; a first bonding head which picks up the die in the first position and bonds it to a substrate or picks up the die in the second position and transfers the die to the die stage located in the first position; and a second bonding head which picks up the die of the die stage and bonds the die to the substrate. Therefore, the apparatus of boding dies can selectively perform a direct bonding process and a multistage bonding process according to the thickness and size of the die.