BOARD THE LOCAL HOT EXPANSION AND SOLVENT THE LOCAL COOLING EXPANSION USING BOARD CUTTING METHOD

摘要

The present invention relates to a method for cutting a substrate by using local thermal expansion of a substrate and local cooling expansion of a solvent, which comprises: a scribing process of moving backward and forward a scribing wheel which rotates at a constant speed to form a crack on one side of a substrate; a cooling process of cooling the substrate having a crack formed in the scribing process; a thermal expansion process of injecting a high-temperature solvent into the crack cooled in the cooling process to thermally expand only the crack on the substrate to firstly microcrack the crack; and a cooling expansion process for secondly microcracking the firstly microcracked crack by cooling expansion which occurs as the thermally expanded solvent in the thermal expansion process is being cooled by the cooled substrate after the thermal expansion. The present invention can provide a method for cutting a substrate by using local thermal expansion of a substrate and local cooling expansion of a solvent, wherein after the substrate having a crack is cooled, the high-temperature solvent is injected into the cooled crack of the substrate to make local thermal expansion on the substrate and then the substrate can be readily cut by local cooling expansion of the solvent according to change in the temperature of the solvent, thereby preventing damage to the cutting section of a substrate and strengthening rupture strength of a substrate, compared to a substrate manufactured by a conventional mechanical breaking process.