METALLIC COPPER DISPERSION, PROCESS FOR PRODUCING THE METALLIC COPPER DISPERSION, ELECTRODE, WIRING PATTERN, AND COATING FILM FORMED USING THE METALLIC COPPER DISPERSION, DECORATIVE ARTICLE AND ANTIMICROBIAL ARTICLE WITH THE COATING FILM FORMED THEREON, AND PROCESSES FOR PRODUCING THE DECORATIVE ARTICLE AND THE ANTIMICROBIAL ARTICLE

摘要

Disclosed is a dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number such that the difference therebetween (amine number - acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number such that the difference therebetween (amine number - acid number) is 0 to 50, into an organic solvent. The dispersion can maintain dispersion stability of the metallic copper particles for a long period of time, is suitable for inkjet printing and spray coating and can be used in the formation of microelectrodes and circuit wiring patterns, for ex-ample, in printed wiring boards, and design and decoration applications utilizing a metallic tone of the coating film.