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THE METHOD FOR PREPARING ORGANIC ELECTRONIC DEVICE
THE METHOD FOR PREPARING ORGANIC ELECTRONIC DEVICE
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机译:一种有机电子器件的制备方法
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摘要
Provided is a method of manufacturing an organic electronic device using a pressure-sensitive adhesive film. The method of manufacturing an organic electronic device including an encapsulation layer having excellent moisture barrier property and adhesiveness may be provided. In addition, according to the manufacturing method, for example, though the encapsulation layer is formed on an entire surface of an organic electronic element, a flexibility phenomenon of the organic electronic device may be minimized, and the organic electronic device may be manufactured without damage to the organic electronic element for a short process time.
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