BONDING METHOD OF A METAL AND A RESIN USING A DUAL-HARDENING EPOXY ADHESIVE COMPOSITION BETWEEN THE TWO KINDS OF MATERIAL AND THE ADHESIVE FORCE HOLDING THE METAL AND THE RESIN

摘要

The present invention relates to a double-curing epoxy adhesive composition in which a metal and a resin are adhered by injecting a metal to maintain a high adhesive strength between dissimilar materials of a metal and a resin, and a method for bonding a metal and a resin using the same From 5 to 10% by weight of a polyurethane acrylate oligomer, from 5 to 10% by weight of an acrylate monomer, from 1 to 5% by weight of a photoinitiator, from 1 to 5% by weight of an adhesion promoter and from 1 to 5% by weight of a polythiol resin as an additive Curing epoxy adhesive composition which maintains a high adhesive strength between a dissimilar material of a metal and a resin further comprising 60 to 80% by weight of a bisphenol A type epoxy resin, 2 to 6% by weight of a latent curing agent and 1 to 5% by weight of a curing accelerator to provide.