首页> 外国专利> COMPOSITION CONTAINING QUANTUM DOT FLUORESCENT BODY, MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN, STRUCTURE CONTAINING QUANTUM DOT FLUORESCENT BODY, LIGHT-EMITTING DEVICE, ELECTRONIC APPARATUS, MECHANICAL DEVICE, AND METHOD FOR PRODUCING MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN

COMPOSITION CONTAINING QUANTUM DOT FLUORESCENT BODY, MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN, STRUCTURE CONTAINING QUANTUM DOT FLUORESCENT BODY, LIGHT-EMITTING DEVICE, ELECTRONIC APPARATUS, MECHANICAL DEVICE, AND METHOD FOR PRODUCING MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN

机译:包含量子点荧光体的模制体,量子点荧光体分散树脂的模制体,结构,包含量子点荧光体,电子装置,设备的本体,模型,方法和装置

摘要

A composition comprising a quantum dot fluorescent material capable of suppressing a quantum toothed fluorescent substance, a quantum dot fluorescent material dispersed resin molded article, a structure including a quantum dot fluorescent material, a light emitting device, an electronic device, a mechanical device, and a method for producing a quantum dot fluorescent material dispersed resin molded article . A quantum dot fluorescent material is dispersed in a cycloolefin (co) polymer which is a water-dispersible resin to form a composition including a quantum dot fluorescent material, and a composition including the quantum dot fluorescent material is molded into a quantum dot fluorescent material dispersion resin molded article. Further, a gas barrier layer for reducing the permeation of oxygen to the quantum dot injection resin molding is formed on a part or the entire surface of the quantum dot fluorescent material dispersion resin molding. Further, the light emitting device can be constituted by using the composition including the quantum dot fluorescent material as a sealing material for sealing the LED chip.
机译:一种组合物,其包含能够抑制量子带齿的荧光物质的量子点荧光材料,分散有量子点荧光材料的树脂成型品,包括量子点荧光材料的结构,发光装置,电子设备,机械设备和一种量子点荧光材料分散树脂模塑制品的生产方法。将量子点荧光材料分散在作为水分散性树脂的环烯烃(共)聚合物中以形成包括量子点荧光材料的组合物,并且将包括量子点荧光材料的组合物模制成量子点荧光材料分散体。树脂成型品。另外,在量子点荧光体分散树脂成型体的一部分或整个表面上形成有用于减少氧向量子点注入树脂成型体的渗透的阻气层。此外,可以通过使用包括量子点荧光材料作为用于密封LED芯片的密封材料的组合物来构成发光器件。

著录项

  • 公开/公告号KR101529997B1

    专利类型

  • 公开/公告日2015-06-18

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20137018027

  • 申请日2012-01-16

  • 分类号C09K11/02;H01L23/29;H01L23/31;

  • 国家 KR

  • 入库时间 2022-08-21 14:58:04

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