首页> 外国专利> METHOD FOR PREPARING SUPER-CONDUCTING HEAT-DISSIPATING ADHESIVE USING SOL-GEL METHOD AND GRAPHENE AND SUPER-CONDUCTING HEAT-DISSIPATING ADHESIVE PREPARED BY THE SAME

METHOD FOR PREPARING SUPER-CONDUCTING HEAT-DISSIPATING ADHESIVE USING SOL-GEL METHOD AND GRAPHENE AND SUPER-CONDUCTING HEAT-DISSIPATING ADHESIVE PREPARED BY THE SAME

机译:用溶胶-凝胶法和石墨烯制备超导散热胶的方法及用其制备的超导散热胶

摘要

Provided are a method for manufacturing a super-conductive heat dissipation adhesive using a sol-gel method and graphene, and a super conductive heat dissipation adhesive manufactured thereby. According to the present invention, the super-conductive heat dissipation adhesive is safe, has excellent bonding force and heat conductivity, and is an inorganic heat dissipation adhesive having good heat resistance, fire resistance, and electromagnetic shielding performance. Furthermore, the invention is a simple single-liquid phase type super-conductive inorganic heat dissipation adhesive which can be applied for various objects such as a high integrated print circuit substrate used for not only an LED device, but also a semiconductor, a display, a vehicle, etc., and an advanced device in a PCB chip shape that generates high heat.
机译:提供一种使用溶胶-凝胶法和石墨烯制造超导散热粘合剂的方法,以及由此制造的超导散热粘合剂。根据本发明,超导散热粘合剂是安全的,具有优异的结合力和导热性,并且是具有良好的耐热性,耐火性和电磁屏蔽性能的无机散热粘合剂。此外,本发明是一种简单的单液相型超导无机散热胶粘剂,其可用于各种目的,例如不仅用于LED器件而且用于半导体,显示器的高集成度印刷电路基板。车辆等以及产生高热量的PCB芯片形状的高级设备。

著录项

  • 公开/公告号KR101534296B1

    专利类型

  • 公开/公告日2015-07-06

    原文格式PDF

  • 申请/专利权人 ECO INFRA HOLDINGS;

    申请/专利号KR20140144018

  • 发明设计人 PARK GI HONG;

    申请日2014-10-23

  • 分类号C09J9/02;C09J183/02;

  • 国家 KR

  • 入库时间 2022-08-21 14:57:59

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