PAIN CURING APPARATUS USING ULTRASONIC WAVE

摘要

The present invention relates to a pain curing apparatus using an ultrasonic wave, which comprises a body including an interface receiving an ultrasonic wave generating condition, and an ultrasonic wave generating part generating an ultrasonic wave generating signal by the ultrasonic wave generating condition input from the interface; and an ultrasonic wave treatment part detachably coupled with the body, and generating an ultrasonic wave corresponding to the ultrasonic wave generating signal to be radiated on a pain part. The ultrasonic wave treatment part comprises an ultrasonic wave treatment head having an ultrasonic wave transducer which generates an ultrasonic wave corresponding to the ultrasonic wave generating signal embedded, and contacting with the skin of a patient; a vacuum pressure forming pipe coupled to surround the ultrasonic wave treatment head, and forming a vacuum pressure for the ultrasonic wave treatment head to be adsorbed on the skin of the patient; a vacuum pressure generating part formed on the body, and applying the vacuum pressure by the vacuum pressure forming pipe; and a head connection line connecting the ultrasonic wave treatment head and the body.;COPYRIGHT KIPO 2015