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Method and device for influencing the layer thickness distribution on substrates and substrates coated in this way
Method and device for influencing the layer thickness distribution on substrates and substrates coated in this way
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机译：影响基材和以此方式涂覆的基材上的层厚度分布的方法和装置
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摘要
The invention relates to a method and a device for influencing the layer thickness distribution on substrates in sputtering processes using at least two magnetrons. Likewise, the invention relates to coated substrates with excellent homogeneity of the coating.
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