首页> 外国专利> ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME

ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME

机译:使用室温温度盐浴的Al-Zr合金电镀浴及其电镀方法

摘要

PROBLEM TO BE SOLVED: To provide an electric Al-Zr alloy plating bath which has no risk of explosion even when it is brought into contact with air or water and with which the deposit of dendrites can be suppressed even on a part where the electrical current density is high, a uniform plated film with good covering power properties can be obtained even on a part where the electrical current density is low, and a plated film exhibiting high corrosion resistance without being subjected to chromate treatment can be obtained.;SOLUTION: Disclosed is an electric Al-Zr alloy plating bath contains an aluminum halide (A), one or more compounds (B) selected from the group comprising N-alkylpyridinium halides or the like, and a zirconium halide (C). The molar ratio between the aluminum halide (A) and the compounds (B) is from 1:1 to 3:1. The electric Al-Zr alloy plating both further contains an aromatic organic solvent (D), one or more organic polymers (E) selected from polymers such as styrene-based polymers, and one or more additives (F) such as a brightening agent selected from aliphatic aldehydes or the like.;COPYRIGHT: (C)2008,JPO&INPIT
机译:要解决的问题:提供一种即使在与空气或水接触时也没有爆炸危险,并且即使在有电流的部分上也可以抑制树枝状沉积的Al-Zr合金电镀液。密度高,即使在电流密度低的部分上,也可以获得具有良好覆盖能力的均匀镀膜,并且可以获得未经铬酸盐处理而具有高耐蚀性的镀膜。是一种Al-Zr合金电镀浴,它包含卤化铝(A),一种或多种选自N-烷基吡啶鎓卤化物等的化合物(B)和卤化锆(C)。卤化铝(A)与化合物(B)之间的摩尔比为1:1至3:1。 Al-Zr合金电电镀层还进一步包含芳族有机溶剂(D),一种或多种选自聚合物的有机聚合物(E)(例如基于苯乙烯的聚合物)和一种或多种添加剂(F)(例如所选择的增白剂)脂肪族醛或类似物制得;版权所有:(C)2008,JPO&INPIT

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号