A high isolation wideband switch is disclosed. In one aspect, the switch includes an integrated circuit package having an integrated circuit die (20) with a first plurality of leads (30, 31, 33) that is positioned on a package substrate (10) that has a second plurality of leads (40, 41, 43). The first leads (30, 31, 33) of the integrated circuit die (20) are connected to the second the leads(40, 41, 43) of the package substrate (20) via bond wires (51, 53) and a first electrical coupling occurs between the first leads (30, 31, 33) and the integrated circuit die (20) in response to an RF signal applied to the integrated circuit package (10). The bond wires (51, 53) have a second electrical coupling in response to the RF signal and the bond wires (51,53) are arranged such (STATE 1-5) that the second electrical coupling is matched to the first electrical coupling within a selected frequency band so as to reduce the overall electrical coupling of the integrated circuit package for RF signals within the selected frequency band.
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