首页> 外国专利> CONNECTION STRUCTURE OF THIN FILM WIRE, HIGH TEMPERATURE SUPERCONDUCTING WIRE USING CONNECTION STRUCTURE, AND HIGH TEMPERATURE SUPER CONDUCTING COIL USING CONNECTION STRUCTURE

CONNECTION STRUCTURE OF THIN FILM WIRE, HIGH TEMPERATURE SUPERCONDUCTING WIRE USING CONNECTION STRUCTURE, AND HIGH TEMPERATURE SUPER CONDUCTING COIL USING CONNECTION STRUCTURE

机译:薄膜线的连接结构,使用连接结构的高温超导电线和使用连接结构的高温超导线圈

摘要

PROBLEM TO BE SOLVED: To provide a connection structure of a thin film wire which is prevented from lowering an allowable stress by extension or connection of the thin film wire, a high temperature superconducting wire using the connection structure, and a high temperature super conducting coil using the connection structure.SOLUTION: The connection structure 10 of a thin film wire obtained by covering a periphery of a tape-shaped laminate 30 including layers composed of at least a substrate 22, and a superconducting layer 25 formed on one face of the substrate 22 with a conductor layer 21 is constituted by bonding a flow route-forming body 12 which becomes a flow route of a superconducting current 11 generated in the thin film wire 20 with a bonding material 14 disposed on a side face 13 of the conductor layer 21 opposite to the superconducting layer 25 with respect to the substrate 22.SELECTED DRAWING: Figure 2
机译:解决的问题:提供一种薄膜线的连接结构,通过该薄膜线的延伸或连接而防止其降低的允许应力,使用该连接结构的高温超导线以及高温超导线圈解决方案:薄膜线的连接结构10是通过覆盖带状层压板30的外围而获得的,该带状层压板30包括至少由基底22组成的层以及在基底的一个面上形成的超导层25如图22所示,通过在导体层21的侧面13上配置有接合材料14,将成为在薄膜线20中产生的超导电流11的流动路径的流动路径形成体12接合,从而形成导体层21。相对于衬底22与超导层25相对的部分。选图:图2

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