首页>
外国专利>
POWER MODULES AND POWER MODULE ARRAYS HAVING MODULAR DESIGN ASPECTS
POWER MODULES AND POWER MODULE ARRAYS HAVING MODULAR DESIGN ASPECTS
展开▼
机译:具有模块化设计方面的功率模块和功率模块阵列
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide power modules having a modular design aspects allowing for disassembly.SOLUTION: A power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within through-holes of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.SELECTED DRAWING: Figure 1
展开▼