EPOXY COMPOUND, PHENOLIC HYDROXYL GROUP-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT THEREOF, SEMICONDUCTOR SEALANT, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDING

摘要

PROBLEM TO BE SOLVED: To provide an epoxy compound that has excellent flowability and provides a cured product having excellent heat resistance, and a phenolic hydroxyl group-containing compound, a curable composition and a cured product thereof, a semiconductor sealant, a semiconductor device, a prepreg, a circuit board, a build-up film, a build-up substrate, a fiber-reinforced composite material, and a fiber-reinforced resin molding.SOLUTION: An epoxy compound has a molecular structure represented by formula (1) (where Rand Rindependently represent a C1-6 hydrocarbon group, a C1-6 alkoxy group, or an aryl group).