Cleaning method and apparatus for use therein for thin film processing application

摘要

According in the present disclosure, without breaking the vacuum within the processing chamber, a method for cleaning a processing chamber of the flexible substrate processing apparatus is provided. Method for cleaning a process chamber, to guide the sacrificial foil into the process chamber, to initiate a first pump process in the process chamber, while the sacrificial foil in a process chamber is provided, to plasma cleaning the processing chamber, to initiate a second pump process in the process chamber, and to guide the sacrificial foil to the outside of the processing chamberFIELD 1