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Method of manufacturing conductive structures on a non-conductive substrate material as well as certain additives and substrate materials therefor

机译:在非导电基底材料以及某些添加剂和基底材料上制造导电结构的方法

摘要

P- present invention has the non-conductive substrate material, a conductive structure, particularly, relates to a method for producing a conductive path, which is an additive containing at least one metal compound (1). The substrate material is contained in the additive (1), for example, as an inorganic metal compound is selectively activated, it is irradiated by a laser. As the conductive structure is forged in the non-conductive substrate material, a metal core formed by the activation is subsequently metallized. Additives (1), before being introduced into the substrate material, in particular provided with a fully coating, as a result, the laser activation, the additive (1) is reduced, and the coating is oxidized If, the reaction partner required for the chemical reaction with the required additive (1) is provided by the coating. Whereby due to the interaction of the substantially reduced substrate material, at the same time, restriction to certain plastics or plastic group are also eliminated.
机译:本发明具有非导电性的基材材料,特别是涉及一种导电结构的导电路径的制造方法,该导电路径是含有至少一种金属化合物(1)的添加剂。基材材料包含在添加剂(1)中,例如,当无机金属化合物被选择性地活化时,其被激光照射。当在非导电基底材料中锻造导电结构时,随后将通过活化形成的金属芯金属化。添加剂(1)在被引入基材材料之前,特别是具有完全涂层的涂层中,结果是激光活化,添加剂(1)还原,涂层被氧化。涂层提供了与所需添加剂(1)的化学反应。由此,由于基本上减少的衬底材料的相互作用,同时也消除了对某些塑料或塑料组的限制。

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