Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat radiation resin material

摘要

An epoxy resin composition having a low melting point, a low melt viscosity, excellent solvent solubility and processability, and excellent in fluidity, processability, flexibility, adhesion, and thermal conductivity, and a cured product thereof provide. The following general formula (I) (Q: a linear part which may have a C1-18 alkyl group in the side chain is a C1-9 alkylene chain, between two consecutive methylene groups in the alkylene chain. An epoxy resin represented by a connecting chain having an ether bond, A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or via a connecting chain, a naphthylene unit, n: 0 to 10). An epoxy resin composition containing the epoxy resin and a curing agent. A composition comprising the epoxy resin.