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Method and Apparatus for Producing and Measuring Dynamically Focused, Steered, and Shaped Oblique Laser Illumination for Spinning Wafer Inspection System
Method and Apparatus for Producing and Measuring Dynamically Focused, Steered, and Shaped Oblique Laser Illumination for Spinning Wafer Inspection System
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机译:用于生产和测量用于旋转晶圆检查系统的动态聚焦,导向和定型倾斜激光照明的方法和设备
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摘要
A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface.;Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.
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