首页> 外国专利> RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE

RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE

机译:树脂组成,树脂片材,固化树脂片材,树脂片材结构,固化树脂片材结构,固化树脂片材结构的制造方法,半导体装置以及LED装置

摘要

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.; embedded image
机译:树脂组合物,其包含环氧树脂单体,包含具有式(I)所示的结构单元的化合物的线型酚醛清漆树脂和填充剂。其中填料通过激光衍射法在粒度分布中具有至少4个峰,其中四个峰分别以不小于0.01μm且小于1μm,不小于1μm且小于1μm的范围存在。 10μm,10μm至50μm以及20μm至100μm,并且其中存在于10μm至50μm范围内的峰包括氧化铝颗粒,并且存在于20μm范围内的峰。 μm至100μm包括氮化硼颗粒。式(I)中,R 1 ,R 2 和R 3 分别独立地表示氢原子,烷基等。 m表示0〜2,n表示1〜7。 “嵌入式图像”

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