VERTICALLY HYBRIDLY INTEGRATED ASSEMBLY HAVING AN INTERPOSER FOR STRESS-DECOUPLING OF A MEMS STRUCTURE, AND METHOD FOR ITS MANUFACTURE

摘要

A structural concept for a vertically hybridly integrated assembly having at least one MEMS component is provided, whose MEMS structure is developed at least partially in the front side of the component and which is electrically contactable via at least one connection pad on the front side of the component. This structural concept is able to be realized in an uncomplicated and cost-effective manner and allows the largely stress-free mounting of the MEMS structure within the chip stack and also ensures a reliable electrical linkage of the MEMS component to further component parts of the assembly. For this purpose, the structural concept provides for mounting the MEMS assembly headfirst on a further component of the chip stack via an interposer and for electrically linking it to the further component via at least one plated contacting in the interposer.