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UPDATING RELIABILITY PREDICTIONS USING MANUFACTURING ASSESSMENT DATA

机译:使用制造评估数据进行可靠性预测

摘要

In an approach to predicting reliability of semiconductor devices, one or more computer processors retrieve a first reliability prediction associated with a first reliability model. The one or more computer processors retrieve manufacturing reliability assessment data for a first manufacturing vintage of semiconductor devices. The one or more computer processors retrieve failure mechanism identification data associated with the manufacturing reliability assessment data. The one or more computer processors determine, based, at least in part, on the manufacturing reliability assessment data and associated failure mechanism identification data, a second reliability prediction. The one or more computer processors determine whether the second reliability prediction matches the first reliability prediction. Responsive to determining the second reliability prediction does not match the first reliability prediction, the one or more computer processors update the first reliability model.
机译:在一种预测半导体器件的可靠性的方法中,一个或多个计算机处理器检索与第一可靠性模型相关联的第一可靠性预测。一个或多个计算机处理器检索半导体器件的第一制造年份的制造可靠性评估数据。一个或多个计算机处理器检索与制造可靠性评估数据相关联的故障机制识别数据。一个或多个计算机处理器至少部分地基于制造可靠性评估数据和相关联的故障机制识别数据来确定第二可靠性预测。一个或多个计算机处理器确定第二可靠性预测是否与第一可靠性预测匹配。响应于确定第二可靠性预测与第一可靠性预测不匹配,一个或多个计算机处理器更新第一可靠性模型。

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