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Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
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机译:包装方法,材料分配方法和设备以及自动测量系统
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摘要
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.
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