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Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing process

机译:在半导体制造过程中通过可见波长光谱法预测紫外线的破坏

摘要

The simulation method is for predicting a damage amount due to ultraviolet rays in manufacturing a semiconductor device. The method includes: calculating particle density by performing simulation based on a differential equation for the particle density; calculating emission intensity at each wavelength in a visible wavelength region based on the calculated particle density; obtaining an electron energy distribution function by comparing the calculated emission intensity at each wavelength in the visible wavelength region with an actually detected emission spectrum in the visible wavelength region with reference to information on emission species and an emission wavelength in a target manufacturing process; predicting an emission spectrum in an ultraviolet wavelength region by using the electron energy distribution function and a reaction cross-sectional area relating to the emission species; and predicting a damage amount due to the ultraviolet rays based on the predicted emission spectrum in the ultraviolet wavelength region.
机译:该模拟方法用于预测在制造半导体器件时由于紫外线造成的损坏量。该方法包括:通过基于颗粒密度的微分方程进行模拟来计算颗粒密度;以及基于计算出的粒子密度,计算可见光波长区域中每个波长的发射强度;参照目标制造工序中的发光种类和发光波长的信息,将计算出的可见光波长区域的各波长的发光强度与可见光波长区域的实际检测出的发光光谱进行比较,求出电子能量分布函数。通过使用电子能量分布函数和与发射物种有关的反应截面积来预测紫外线波长范围内的发射光谱;根据所预测的紫外线波长区域的发射光谱,预测由于紫外线引起的损伤量。

著录项

  • 公开/公告号US9287097B2

    专利类型

  • 公开/公告日2016-03-15

    原文格式PDF

  • 申请/专利权人 SONY CORPORATION;

    申请/专利号US201213675751

  • 申请日2012-11-13

  • 分类号H01J37/32;H01L21/3065;G06F17/50;G01J1/42;

  • 国家 US

  • 入库时间 2022-08-21 14:31:24

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