首页>
外国专利>
Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing process
Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing process
展开▼
机译:在半导体制造过程中通过可见波长光谱法预测紫外线的破坏
展开▼
页面导航
摘要
著录项
相似文献
摘要
The simulation method is for predicting a damage amount due to ultraviolet rays in manufacturing a semiconductor device. The method includes: calculating particle density by performing simulation based on a differential equation for the particle density; calculating emission intensity at each wavelength in a visible wavelength region based on the calculated particle density; obtaining an electron energy distribution function by comparing the calculated emission intensity at each wavelength in the visible wavelength region with an actually detected emission spectrum in the visible wavelength region with reference to information on emission species and an emission wavelength in a target manufacturing process; predicting an emission spectrum in an ultraviolet wavelength region by using the electron energy distribution function and a reaction cross-sectional area relating to the emission species; and predicting a damage amount due to the ultraviolet rays based on the predicted emission spectrum in the ultraviolet wavelength region.
展开▼